Ormco Expands Digital Bonding

Posted: May 1, 2026
Edited by Dentaltown staff

Brea, Calif.—Ormco announced expanded capabilities for Ormco Digital Bonding, adding support for additional orthodontic bracket systems including Damon Clear, Mini Diamond, Orthos, Titanium Orthos and Mini-Twin. The updates were announced ahead of the AAO Annual Session in Orlando, Florida.

The company said the digital bonding workflow is designed to improve treatment efficiency and bracket placement precision. Existing compatibility includes Damon Ultima, Symetri Clear and Damon Q2 systems.

Ormco also announced enhancements to its EtchFree Bonding system, including a new twist-top unit-dose delivery design intended to simplify application and reduce waste. The product will appear in the AAO 2026 New Product Showcase.

Additional products featured at the meeting include Spark Clear Aligners, Spark Junior, Spark BiteSync, Spark StageRx, Damon Ultima and AOA Lab 3D-printed appliances.

For more information, visit ormco.com.
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